| 摘要 |
The present invention relates to a circuit, an integrated circuit package and methods for attaching integrated circuit dies or discrete power components to flanges of integrated circuit packages, wherein each of said integrated circuit dies is sawed from a wafer. The invention comprises reducing the thickness of said wafer by mechanical grinding, applying an isotropic wet chemical etching to said wafer to eliminate crystal defects, evaporating adhesion and diffusion barrier metals on the backside of said wafer, evaporating Au and Sn on the backside of the wafer, wherein the weight proportion of Au is equal to or larger than 85%, sawing the wafer into said circuit dies, and soldering each of said circuit dies to a respective flange of an integrated circuit package. <IMAGE> |
