| 摘要 |
A two pack type water-soluble epoxy resin-based adhesive composition for a ceramic tile is provided to improve water fastness, heat resistance, adhesive strength and curing velocity, to reduce the uncuring at a low temperature and to enhance environmental friendliness. A two pack type water-soluble epoxy resin-based adhesive composition comprises a base which comprises 30-40 wt% of a water-soluble epoxy resin, 0.05-0.1 wt% of a dispersant, 0.1-0.5 wt% of a preservative, 0.1-0.5 wt% of a thickener, 0.05-0.1 wt% of a pH controller, 0.3-1.0 wt% of a silane coupling agent, 45-60 wt% of a filler, and 5-15 wt% of a diluting solvent; and a curing part which comprises 10-20 wt% of a water-dispersible polyamine-based curing agent, 0.05-0.1 wt% of a dispersant, 0.1-0.5 wt% of a preservative, 0.3-1.0 wt% of yellow soil, 0.05-0.1 wt% of a pH controller, 0.01-0.1 wt% of an antifoaming agent, 60-70 wt% of a filler, and 10-20 wt% of a diluting solvent. |
