bonding apparatus of camera module and F-PCB by pulse heating,申请号KR20060049702-传众专利搜索

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发明名称	bonding apparatus of camera module and F-PCB by pulse heating
摘要
申请公布号	KR100787857(B1)	申请公布日期	2007.12.24
申请号	KR20060049702	申请日期	2006.06.02
申请人		发明人
分类号	H05K13/04	主分类号	H05K13/04
代理机构		代理人
主权项
地址

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