发明名称 METHOD OF FABRICATING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a process of producing and a method of fabricating high productivity TFTs having different LDD structures at the same time on an identical substrate, and also to provide novel structures of the process and the method. SOLUTION: The process is implemented by employing a highly heat-resisting Ta film or Ta-based film for a wiring material, and in addition by covering with a protection layer to enable heat-treating at a high temperature (400 to 700°C). Using the protection layer as an etching stopper, the process includes, in producing a peripheral driving circuit structure, arranging TFTs having an LDD structure through self-alignment process using sidewalls 126, while, in producing a pixel matrix, arranging TFTs having an LDD structure through non-self-alignment process using insulators 125. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007329497(A) 申请公布日期 2007.12.20
申请号 JP20070203890 申请日期 2007.08.06
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 YAMAZAKI SHUNPEI;FUJIMOTO ETSUKO;ISOBE ATSUO;TAKAYAMA TORU;FUKUCHI KUNIHIKO
分类号 H01L21/336;H01L21/8234;H01L27/08;H01L27/088;H01L29/786 主分类号 H01L21/336
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