Multi-sensor chip module for detecting rotor position in electric machine, has grouting compound contacting area of carrier such that sensor units are encapsulated and expose heat discharging area of heat conductive unit

摘要

The module has sensor units (10) e.g. semiconductor sensor chips, arranged on a carrier (3) such as printed circuit board, that has a slot with sharp reference edges (4). The carrier is formed as a heat conductive unit that has heat discharging area connected with a heat sink. The sensor units directly contact the carrier or connected with the carrier by an adhesive layer. A reinforced grouting compound integrally extends over the sensor units and contacts an area of the carrier defining the sensor units such that the sensor units are encapsulated and expose the heat discharging area. An independent claim is also included for a method for manufacturing a sensor module.