| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a resin composition low in cost and low in thermal expansion, a prepreg, a laminated board and a wiring board. <P>SOLUTION: The resin composition used for manufacturing the laminated board contains an insulating resin having aromatic ring, of which the molecular weight between bridging points obtained from modulus of shearing elasticity at its Tg (glass transition temperature) or higher, is 300-1,000 in the step after the manufacture of the laminated board. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
