| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a joining method which can reduce a cycle time of a device and highly precisely mount a flexible substrate on a glass substrate. <P>SOLUTION: A flexible substrate is sucked and held to a suction member of an ultrasonic horn, a glass substrate is sucked and held to a substrate holder, and an alignment mark provided to the flexible substrate and an alignment mark provided to the glass substrate are subjected to image recognition by a recognition means. After a gold plating electrode of the flexible substrate and a gold plating electrode of the glass substrate are aligned and superposed, the gold plating electrodes are subjected to metallic joining by ultrasonic oscillation. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
