| 摘要 |
PROBLEM TO BE SOLVED: To enable a penetration range of underfill resin to be restricted even when a connection terminal is arranged at a position other than an edge of a rigid substrate to prevent a problem caused by excessive spreading of the penetration range. SOLUTION: This is a connection structure of a wiring substrate in which connection terminals 4 and 14 are formed on insulating substrates 2 and 11, respectively, of a rigid substrate 1 and a flexible substrate 10; both these connection terminals 4 and 14 are directly bonded with each other; and underfill resin 21 is filled around both the bonded connection terminals 4 and 14, wherein a through-hole 5 is prepared around the connection terminal 4 on the insulating substrate 2 of the rigid substrate 1. COPYRIGHT: (C)2008,JPO&INPIT
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