| 发明名称 |
Power distribution within a folded flex package method and apparatus |
| 摘要 |
A device includes a folded flex substrate. A memory die is connected to a first side of the folded flex substrate. A logic die is connected to a second side of the folded flex substrate. A trace routing pattern of source voltage signals is identical to a trace routing pattern of collector voltage signals.
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| 申请公布号 |
US7304373(B2) |
申请公布日期 |
2007.12.04 |
| 申请号 |
US20040977908 |
申请日期 |
2004.10.28 |
| 申请人 |
INTEL CORPORATION |
发明人 |
TAGGART BRIAN;NICKERSON ROBERT M.;SPREITZER RONALD L. |
| 分类号 |
H01L23/02 |
主分类号 |
H01L23/02 |
| 代理机构 |
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