| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a ceramic package for storing electronic component corresponding to reduction in weight and size of the package. <P>SOLUTION: The ceramic package 10 for storing individual pieces of electronic components that is formed through division along a dividing groove 11 from a ceramic package assembly 30 formed of a multilayer structure. In this ceramic package 10, a plurality of through-holes 14 respectively crossing the center points are provided to a part where the dividing groove 11 is provided, a first metalized film 17 is provided to the wall surface of the through-holes 14, a second metalized film 18 is provided to the periphery of the upper surface side of the through-holes 14 through connection with the entire circumferential edge of the upper surface side of the first metalized film 17, a gap (a) exceeding 0.20 mm is provided between the second metalized films 18 adjacent to the part where the dividing groove 11 is provided, and furthermore the second metalized film 18 has at least a width in the side where the dividing groove 11 is provided that is narrower than the width in the side orthogonally crossing the dividing groove 11. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
