| 摘要 |
A method for fabricating a thermal cap for cooling an electronic device includes steps of: machining a main housing of the thermal cap from a single element of a thermally conducting material; and fabricating a top plate including a centered intact area within the main housing by machining orifices around a perimeter of the main housing. The orifices represent a gap between the top plate and the main housing to allow movement of the top plate in the x, y, and z directions. Additionally, moveable connectors are fabricated along an edge of the top plate by cutting connector orifices in the main housing to allow movement of the top plate in the x direction; and moveable bars coupled with the moveable connectors are fabricated by cutting slot orifices in the main housing to allow movement of the top plate in the y and z directions.
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