PHOTO-CURABLE RESIN COMPOSITION, PHOTO-CURABLE MOISTURE-PREVENTING INSULATION COATING FOR MOUNTING CIRCUIT BOARD, ELECTRONIC PART AND METHOD FOR PRODUCING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a photo-curable resin composition giving a small environmental load and suitable for the insulation of an electronic part, a photo-curable moisture-preventing insulation coating for a mounting circuit board, an insulation-treated electronic part having a high reliability and a method for producing the same. SOLUTION: This photo-curable resin composition contains (A) a urethane compound having an ethylenically unsaturated double bond obtained by reacting (a1) a polyolefinpolyol compound, (a2) an ethylenically unsaturated compound having hydroxy group and (a3) a compound having≥2 isocyanate groups in one molecule, (B) a photopolymerizable monomer having an ethylenically unsaturated double bond and a heterocyclic structure and (C) a photo polymerization initiator. COPYRIGHT: (C)2008,JPO&INPIT