| 摘要 |
The present invention provides a molding apparatus for encapsulating a semiconductor substrate in which a plurality of semiconductor chips are formed and a method of manufacturing the semiconductor substrate using the same. The molding apparatus includes an upper half for fixing the semiconductor substrate and a lower half having a projecting part projecting to the semiconductor substrate. An encapsulation resin material is mounted on the top surface of the projecting part, and then the semiconductor substrate is encapsulated with an encapsulation resin material. Thus, the melted encapsulation resin material uniformly extends from the center of the semiconductor substrate. In addition, the resin encapsulation is performed while forming a vacuum in a cavity, so that air voids generated in a resin-encapsulated part can be effectively prevented. |
