摘要 |
A MEMS device (100, 300) and method of fabrication including a plurality of structural tie bars (108, 303, 304) for added structural integrity. The MEMS device includes an active layer (202) and a substrate (102) having an insulating material (204) formed therebetween, first and second pluralities of stationary electrodes (103, 105) and a plurality of moveable electrodes (107) in the active layer. A plurality of interconnects (106, 301, 302) are electrically coupled to a second surface of each of the first and second pluralities of stationary electrodes. A plurality of anchors (226) fixedly attach a first surface of each of the first and second pluralities of stationary electrodes to the substrate. A first structural tie bar couples a second surface of each of the first plurality of stationary electrodes and a second structural tie bar couples a second surface of each of the second plurality of stationary electrodes.
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申请人 |
FREESCALE SEMICONDUCTOR;LI, GARY G.;GOGOI, BISHNU;DESAI, HEMANT D.;HAMMOND, JONATHAN HALE;DIEM, BERNARD |
发明人 |
LI, GARY G.;GOGOI, BISHNU;DESAI, HEMANT D.;HAMMOND, JONATHAN HALE;DIEM, BERNARD |