| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device comprising adhesive agent for preventing damage, etc. of a semiconductor element, and to provide a method for manufacturing it and an electronic apparatus having the semiconductor device. SOLUTION: In this semiconductor device; a semiconductor element, and a substrate, or a semiconductor element and a semiconductor element are bonded via the adhesive agent. After electrically connecting the semiconductor element to the substrate by wire bonding, the device is so sealed with a sealing resin as to cover the semiconductor element and the bonding wire. The sealing resin contains an inorganic filler. The adhesive agent has an elastic modulus of 6 MPa or above at a sealing temperature at which sealing resin is sealed. COPYRIGHT: (C)2008,JPO&INPIT
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