发明名称 POSITIVE RESIST COMPOSITION AND RESIST PATTERN FORMING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a positive resist composition and a resist pattern forming method for forming a resist pattern with reduced line width roughness. <P>SOLUTION: The positive resist composition comprises a resin component (A) which undergoes an increase in the alkali solubility by the action of an acid and an acid generator component (B) capable of generating an acid upon exposure to light, wherein the resin component (A) has a tertiary alkyl ester type acid-dissociable dissolution inhibiting group and the acid generator component (B) comprises an onium salt (B1) having a fluorine atom-containing anionic moiety and an onium salt (B2) having a fluorine atom-free anionic moiety. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007304528(A) 申请公布日期 2007.11.22
申请号 JP20060136291 申请日期 2006.05.16
申请人 TOKYO OHKA KOGYO CO LTD 发明人 UCHIUMI YOSHIYUKI
分类号 G03F7/039;G03F7/004;H01L21/027 主分类号 G03F7/039
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