发明名称 SUBSTRATE MATERIAL FOR PROCESS RELEASE PAPER AND METHOD FOR PRODUCING THE PROCESS RELEASE PAPER BY USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a substrate material for a process release paper capable of preparing a process release paper, without forming roughness on a molding surface even on forming emboss under a high temperature in order to give a further deep emboss, and having a surface having a feeling, and a method for producing the process release paper by using the same. SOLUTION: This substrate material for process release paper consists of a paper layer 1 and an emboss-processing layer 4 installed on the same, the emboss-processing layer 4 consists of 2 layers of a first thermoplastic resin layer 2 and a second thermoplastic resin layer 3, and the first thermoplastic resin layer can be peeled off from the second thermoplastic resin layer. The process release paper is constituted so that after giving an embossing process on the emboss-processing layer 4 by heat embossing, the first thermoplastic resin layer is peeled off and the second thermoplastic resin layer 3 can be exposed. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007297729(A) 申请公布日期 2007.11.15
申请号 JP20060124693 申请日期 2006.04.28
申请人 DAINIPPON PRINTING CO LTD 发明人 SHIINA TOKUYUKI
分类号 D21H27/00;B32B23/08;D21H27/30 主分类号 D21H27/00
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