INTEGRIERTE SCHALTUNGSANORDNUNG, ELEKTRONISCHES MODUL FÜR CHIPKARTE, DAS DIE ANORDNUNG BENUTZT, UND VERFAHREN ZU DEREN HERSTELLUNG

摘要

This invention relates to an integrated circuit device, in particular for manufacturing smart card electronic units for smart cards. It comprises: an active layer ( 32 ) including a semiconductor material within which integrated circuits are formed and having a face ( 34 ) provided with a plurality of electrical connection terminals ( 36 ) and a second face, wherein said face has a thickness smaller than 100 mum, and a complementary layer ( 40 ) having a first face ( 42 ) attached to the active face of the active layer, a second face ( 44 ) and a side surface ( 48 ), wherein said complementary layer includes a plurality of recesses ( 46 ), each recess extending through the whole thickness of the complementary layer, and extending from a contact terminal ( 36 ) to said side surface ( 48 ).