发明名称 |
Solder ball pad structure |
摘要 |
An interconnect structure a substrate, a contact pad disposed over a surface of the substrate, and an insulative mask disposed over the contact pad. The insulative mask can include an opening that is aligned over and exposes an inner portion of the contact pad. The inner portion of the contact pad includes a compliant layer and a conductive layer that is disposed over the compliant layer. The inner portion of the contact pad has sufficient flexibility to distribute mechanical stress applied to the contact pad and can mitigate damage to the interconnect structure. |
申请公布号 |
US7294929(B2) |
申请公布日期 |
2007.11.13 |
申请号 |
US20030750059 |
申请日期 |
2003.12.30 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
MIYAZAKI HIROSHI |
分类号 |
H01L29/40;H01L21/44;H01L21/60;H01L23/48;H01L23/485;H05K1/02;H05K1/11;H05K3/34;H05K3/40 |
主分类号 |
H01L29/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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