发明名称 APPARATUS AND METHOD FOR ETCHING AND EDGE OF A SUBSTRATE
摘要 An apparatus and a method for processing a substrate are provided to block a center portion of the substrate from inflow of fume of a treatment liquid and micro particles floated in the air, when removing the remaining polluted material. A support member(14) supports the substrate. A treating liquid suppler(20) injects the treating liquid to the substrate mounted on the support member. A protection cover(100) prevents a center portion of the substrate from inflow of the treating liquid. A polluted material preventing member is installed to block an edge portion and the center portion of the substrate for preventing the center portion from being polluted from the polluted materials.
申请公布号 KR20070107978(A) 申请公布日期 2007.11.08
申请号 KR20060040637 申请日期 2006.05.04
申请人 SEMES CO., LTD. 发明人 KIM, HYUN JONG;SUNG, BO RAM CHAN
分类号 H01L21/306;H01L21/02 主分类号 H01L21/306
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