发明名称 SUBSTRATE COOLING DEVICE AND STRUCTURE COOLING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a substrate cooling device which can obtain high cooling efficiency and keep an even temperature distribution in the plane of a substrate during cooling. SOLUTION: The steam of a coolant is compressed into superheated steam by a compressor 20 and then is cooled and condensed by a capacitor 30, so that a supercooled liquid of the coolant is obtained. The supercooled liquid is expanded and decompressed by passing through an expansion valve 40, so that a mixed phase of the saturated liquid and saturated steam of the coolant is obtained. Next, the mixed fluid is separated into a vapor phase and a liquid phase by a liquid separator 50, and only the saturated liquid of the coolant is supplied to a cold plate 10. The hollow portion of the cold plate 10 is filled only with the saturated liquid of the coolant. It is thus possible to obtain high cooling efficiency sufficiently using boiling heat transfer and keep an even temperature distribution in the plane of the plate because the saturated liquid does not have a pressure difference. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007294887(A) 申请公布日期 2007.11.08
申请号 JP20070055644 申请日期 2007.03.06
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 MURAOKA YUSUKE;MIYAJI YASUYOSHI
分类号 H01L21/02;F25B1/00;F25B43/00;F25B49/02 主分类号 H01L21/02
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