发明名称 GRINDING METHOD OF SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a method for grinding the surface of a non-circular shaped substrate with excellent flatness. SOLUTION: In the grinding method for the substrate, the grinding wheel is contacted with the surface of the substrate while rotating the substrate 3 and the grinding wheel 2. The non-circular shaped substrate 3 is used as the substrate, a dummy material 4 is disposed on the peripheral edge part of the non-circular shaped substrate, and the dummy material is disposed so that the grinding wheel always maintains a constant contact area with a surface formed by the non-circular shaped substrate and the dummy material. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007290078(A) 申请公布日期 2007.11.08
申请号 JP20060121112 申请日期 2006.04.25
申请人 TOSOH CORP 发明人 TANIGUCHI TAKASHI;TAKATO SHUJI;ASANO MUTSUMI
分类号 B24B7/24;B24B1/00;B24B41/06 主分类号 B24B7/24
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