发明名称 |
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRUIT BOARD |
摘要 |
A chip capacitor 20 is provided in a core substrate 30 of a printed circuit board 10 . This makes it possible to shorten a distance between an IC chip 90 and the chip capacitor 20 and to reduce loop inductance. Since the core substrate 30 id constituted by provided a first resin substrate 30 a, a second resin substrate 30 b and a third resin substrate 30 c in a multilayer manner, the core substrate 30 can obtain sufficient strength.
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申请公布号 |
US2007258225(A1) |
申请公布日期 |
2007.11.08 |
申请号 |
US20070777841 |
申请日期 |
2007.07.13 |
申请人 |
IBIDEN, CO., LTD. |
发明人 |
INAGAKI YASUSHI;ASAI MOTOO;WANG DONGDONG;YABASHI HIDEO;SHIRAI SEIJI |
分类号 |
H05K1/18;H01L21/48;H01L23/498;H01L23/50;H01L23/64;H01L25/16;H05K1/02;H05K3/46 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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