| 发明名称 |
REDUCED OXIDATION SYSTEM FOR WIRE BONDING |
| 摘要 |
A wire bonding machine is provided. The wire bonding machine includes (1) a bond site area for holding a semiconductor device during a wire bonding operation, and (2) a gas supply line configured to provide a gas at the bond site area from above the bond site area.
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| 申请公布号 |
US2007251980(A1) |
申请公布日期 |
2007.11.01 |
| 申请号 |
US20060380233 |
申请日期 |
2006.04.26 |
| 申请人 |
GILLOTTI GARY S;MAK STEVEN;FRASCH E W |
发明人 |
GILLOTTI GARY S.;MAK STEVEN;FRASCH E. W. |
| 分类号 |
B23K37/00;B23K35/38 |
主分类号 |
B23K37/00 |
| 代理机构 |
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代理人 |
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