| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board which improves heat conductivity and heat radiation property, and improves reliability with respect to thermal stress or the like. SOLUTION: A CFRP core layer 4 is provided which is configured by coating a CFRP core 1 constituted of a resin composition including a carbon fiber material with a resin insulating layer 2 containing aramid fibers. COPYRIGHT: (C)2008,JPO&INPIT |
