| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a technology in which in a mounting board mounting a semiconductor chip, a distance in a thickness direction of the mounting board is allowed to prolong, but an area of the surface is reduced, whereas the semiconductor chip can effectively be cooled. <P>SOLUTION: A recess 30 is formed on a surface of a board 2 so that a semiconductor chip 20 having such an attitude that a front and rear face of the semiconductor chip 20 are perpendicular to the surface of the board 2 can be accommodated. On a side wall of the recess 30, a first wiring pattern connected to one main electrode of the semiconductor chip 20 and a second wiring pattern connected to the other main electrode of the semiconductor chip 20 are formed. The one main electrode of the semiconductor chip 20 is connected and fixed to the first wiring pattern by a conductive material 18, and the other main electrode of the semiconductor chip 20 is connected and fixed to the second wiring pattern by the conductive material 18. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
