| 摘要 |
PROBLEM TO BE SOLVED: To provide a prepreg usable for a printed wiring board for mounting an LED, having high light reflectivity in a near ultraviolet region, hardly causing reduction of the light reflectivity by heat treatment, and having excellent thermal conductivity and heat resistance; and to provide a copper clad laminate. SOLUTION: The prepreg comprises the resin composition containing (A) a bisphenol A novolak-type epoxy resin, (B) an alicyclic epoxy resin, and (C) boron nitride, and a base material. COPYRIGHT: (C)2008,JPO&INPIT |
