发明名称 DIE ATTACHMENT WITH REDUCED ADHESIVE BLEED-OUT
摘要 AN ORGANIC CHIP CARRIER HAVING CIRCUITRY AND WIRE BOND PADS THEREON IS BONDED TO AN INTEGRATED CIRCUIT DIE BY A PHOTOCURABLE ADHESIVE AND IS ELECTRICALLY CONNECTED THEREWITH BY WIRE BONDING TO THE WIRE BOND PADS.
申请公布号 MY133136(A) 申请公布日期 2007.10.31
申请号 MY1999PI02398 申请日期 1999.06.11
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 BERND KARL APPELT;GARY ALAN JOHANSSON;KONSTANTINOS I. PAPATHOMAS
分类号 H01L21/60;H01L23/48;B32B33/00;H01L21/52;H01L21/58;H01L21/607;H01L23/52;H01L29/40 主分类号 H01L21/60
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