发明名称 |
DIE ATTACHMENT WITH REDUCED ADHESIVE BLEED-OUT |
摘要 |
AN ORGANIC CHIP CARRIER HAVING CIRCUITRY AND WIRE BOND PADS THEREON IS BONDED TO AN INTEGRATED CIRCUIT DIE BY A PHOTOCURABLE ADHESIVE AND IS ELECTRICALLY CONNECTED THEREWITH BY WIRE BONDING TO THE WIRE BOND PADS. |
申请公布号 |
MY133136(A) |
申请公布日期 |
2007.10.31 |
申请号 |
MY1999PI02398 |
申请日期 |
1999.06.11 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BERND KARL APPELT;GARY ALAN JOHANSSON;KONSTANTINOS I. PAPATHOMAS |
分类号 |
H01L21/60;H01L23/48;B32B33/00;H01L21/52;H01L21/58;H01L21/607;H01L23/52;H01L29/40 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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