发明名称 SOLDER ALLOY AND SOLDERED BOND
摘要 A solder alloy having a solderability comparable to that of a conventional Pb-Sn solder alloy without having a detrimental effect on the environment and a soldered bond using the same. <??>A solder alloy consisting of Zn: 4.0-10.0 wt%, In: 1.0 to 15.0 wt%, Al: 0.0020 to 0.0100 wt%, and the balance of Sn and unavoidable impurities. A soldered bond of an electric or electronic device composed of the above solder alloy. <IMAGE>
申请公布号 KR100768904(B1) 申请公布日期 2007.10.23
申请号 KR20037001486 申请日期 2003.01.30
申请人 发明人
分类号 B23K35/26;C22C13/00 主分类号 B23K35/26
代理机构 代理人
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