| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed-wiring board capable of forming a high-density circuit including circuit components easily and capable of forming a bent section easily, and to provide electronic equipment capable of incorporating the high-density circuit by utilizing a limited packaging space in a casing. SOLUTION: In the printed-wiring board, a sheet-like base 10 in which a circuit component 21 is packaged at one surface 10a is bent to the side of the packaging surface of the circuit component 21 in the middle, and an adhesive resin 30 is embedded between the overlapped bases, and the area between the overlapped bases is sealed with an adhesive resin 30. COPYRIGHT: (C)2008,JPO&INPIT |
