| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition having good flowability of an epoxy resin, capable of high loading of an inorganic filler, and giving a cured product having excellent moisture resistance and dielectric properties (low dielectric constant and low dielectric loss tangent), and its cured product; to provide a semiconductor sealing material having excellent warp characteristics, moisture resistance and dielectric properties; and to provide a semiconductor device. SOLUTION: An epoxy resin (A) which is prepared by reacting a dihydroxy naphthalene such as 2,7-dihydroxy naphthalene with aβ-alkyl epihalohydrin and has a content of aβ-alkyl glycidyl group in the whole epoxy group of≥95% and a curing agent (B) are essential components of the epoxy resin composition. COPYRIGHT: (C)2008,JPO&INPIT
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