| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroconductive adhesive hardly increasing connection resistance with time in high temperature high moisture atmospheres even when applied to a base metal terminal electrode or a base metal electrode part, and to provide electronic devices hardly increasing connection resistance with time in high temperature high moisture atmospheres. SOLUTION: The electroconductive adhesive composition comprising (A) an electroconductive metal powder (such as silver powder), and (B) a thermoset/adhesive resin (such as epoxy resin) -based binder is provided, wherein the electroconductive adhesive comprises the ingredient (A) of 72.5-91.0 wt.%, the ingredient (B) of 27.5-9.0 wet.% and (C) an aromaticβ-ketone (such as 1,3-diphenyl-1,3-propanedione) of 0.08-1.5 wt.%, water-insoluble, solid at normal temperature and having a lower melting point than the curing temperature of the thermoset/adhesive resin. The electronic device, whose electronic element terminal electrode is electrically connected to an electrode-land of a circuit board with the cured product of the electroconductive adhesive and whose electronic element is mounted on the circuit board, is provided, and the method for producing the electronic device is provided. COPYRIGHT: (C)2008,JPO&INPIT
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