| 摘要 |
An upper die portion ( 36 ) of a die head for aligning probe pins ( 14 ) in first array of first micro-holes ( 18 ) formed in lower die portion ( 12 ) of the die head, which generally includes a spacer portion ( 38 ), a support frame ( 40 ), and first and second assembly aid films ( 42 ) and ( 44 ), respectively. Spacer portion ( 38 ) is adapted to contact lower die portion ( 12 ). First assembly aid film ( 42 ) is typically positioned between second surface ( 48 ) and support frame ( 40 ) and includes a second array of second micro-holes ( 50 ) adapted to receive probe pins ( 14 ). Second assembly aid film ( 44 ) generally is in contact or close proximity to first assembly aid film ( 42 ) and has a third array of third micro-holes ( 52 ) adapted to receive probe pins ( 14 ). Second array of second micro-holes ( 50 ) and third array of third micro-holes ( 52 ) are patterned to align with one another but are both offset with first array of first micro-holes ( 18 ) by approximately the lateral distance between probe tip ( 20 ) and probe head ( 28 ). |
