发明名称 Composite material having high thermal conductivity and low thermal expansion coefficient, and heat-dissipating substrate, and their production methods
摘要 A composite material having a high thermal conductivity and a small thermal expansion coefficient, which is obtained by impregnating a porous graphitized extrudate with a metal; the composite material having such anisotropy that the thermal conductivity and the thermal expansion coefficient are 250 W/mK or more and less than 4x10<SUP>-6</SUP>/K, respectively, in an extrusion direction; and that the thermal conductivity and the thermal expansion coefficient are 150 W/mK or more and 10x10<SUP>-6</SUP>/K or less, respectively, in a direction perpendicular to the extrusion direction.
申请公布号 US7282265(B2) 申请公布日期 2007.10.16
申请号 US20040845257 申请日期 2004.05.14
申请人 HITACHI METALS, LTD. 发明人 FUKUSHIMA HIDEKO
分类号 B32B5/18;B32B3/26;B32B5/04;B32B15/04;C04B41/45;C04B41/52;C04B41/81;C04B41/89;C22C1/10;H01L21/48;H01L23/373 主分类号 B32B5/18
代理机构 代理人
主权项
地址
您可能感兴趣的专利