发明名称 POLISHING LIQUID FOR METAL
摘要 PROBLEM TO BE SOLVED: To provide a polishing liquid for a metal which has a high chemical mechanical polishing speed, has improved planarity with less dishing, can improve copper/tantalum selectivity and enables to manufacture an LSI. SOLUTION: The polishing liquid contains a 1, 2, 3-triazole derivative having a specific substituent, and an oxidizing agent. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007266075(A) 申请公布日期 2007.10.11
申请号 JP20060085667 申请日期 2006.03.27
申请人 FUJIFILM CORP 发明人 INABA TADASHI;MATSUNO TAKAHIRO
分类号 H01L21/304 主分类号 H01L21/304
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