| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of preventing the crush/break of electrode wiring which is formed on a substrate, and the coming-off of a semiconductor element by preventing the warp of the substrate. <P>SOLUTION: A semiconductor light emitting device is constituted by sealing semiconductor light emitting elements mounted on the substrate 1 with a resin by first and second metallic molds having a cavity, and arranging a plurality of electrodes which are formed along surfaces, that is, the upper surface with the semiconductor element mounted thereon and the side and lower surfaces, at fixed separation distance from the adjacent electrode. The electrodes include arms 331-334 which are extended toward the adjacent electrode, at positions on the lower surface of the substrate which is the rear side of the position where the first mold is abutted onto the upper surface of the substrate. <P>COPYRIGHT: (C)2008,JPO&INPIT |
