| 摘要 |
PROBLEM TO BE SOLVED: To provide a sensor device capable of making the size compact by using a sensing part as a circuit part forming area. SOLUTION: A sensor substrate 1 is a semiconductor substrate and is provided with a support part 11 arranged with a connecting metal layer 19, serving as a connection part to an external circuit. The support part 11 is formed into a frame shape that surrounds the sensing part Ds. The sensing part Ds is provided with a mass body 12 displaced due to the action of acceleration, and the mass body 12 is connected continuously integrally to the support part 11 via a flexible deflection part 13. The resistance value of a piezoresistance provided in the deflection part 13 is changed, when the mass body 12 displaced, and the acceleration acting on the mass body 12 is found based thereon. One part of a circuit part D that is to be used for detecting the change in the resistance value of the piezoresistance is formed in the mass body 12. COPYRIGHT: (C)2008,JPO&INPIT
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