| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the following problems that the surface of an upper part of a light emitting element array chip with a resin lens part directly molded to a light emitting part with the resin lens part 30 and a resin base layer 31 formed in the vicinity of the light emitting part generally has a concavity and convexity and is not uneven to cause that the rear surface of the light emitting element array chip and the surface of the substrate cannot be bonded, which prevents cost reduction and high quality enhancement of the array chip during and after its manufacturing. <P>SOLUTION: The light emitting element array chip comprises a light emitting element resin part comprising the resin lens part, the resin base layer, and at least one additional resin part. When a first peak point of any of the additional resin part and the resin lens part with a length in a height direction from the rear surface of the light emitting element array chip maximum, and a second maximum peak point except the first peak point, are regulated, the absolute value of the difference between the length from the rear surface of the light emitting array chip to the first peak point and the length from the rear surface of the light emitting element array chip to the second peak point is not more than 9 μm. <P>COPYRIGHT: (C)2008,JPO&INPIT |
