| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate with a built-in coil that has high mounting strength of a semiconductor chip or a chip component mounted on the upper face or the under face of a substrate by enhancing metallization strength of a surface conductor of the substrate with a built-in coil. <P>SOLUTION: A wiring board manufacturing method has a step for preparing a plurality of ferrite green sheets 1, a step for forming a surface conductor pattern 2 by printing a surface conductor paste on the surface of the ferrite green sheet 1, a step for forming an inner-layer conductor pattern 3 corresponding to the surface conductor pattern 2 by printing an inner-layer conductor paste on the rear face of the ferrite green sheet 1 or the surface of other ferrite green sheet 1, a step for manufacturing a laminated body 6 in which the surface conductor pattern 2 is located on the surface and the inner-layer conductor pattern 3 faces the surface conductor pattern 2, and a step for baking the laminated body 6. It is preferable that the inner-layer conductor pattern 3 is formed into the same shape as the surface conductor pattern 2. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
