发明名称 |
COPPER ELECTROLYSIS SOLUTION CONTAINING COMPOUND HAVING SPECIFIC SKELETON AS ADDITIVE, AND ELECTROLYTIC COPPER FOIL PRODUCED THEREFROM |
摘要 |
<p>The object of the present invention is to obtain a low profile electrolytic copper foil with low surface roughness at the rough surface side (opposite side from the glossy side) in the electrolytic copper foil manufacture using a cathode drum, and particularly to obtain an electrolytic copper foil with excellent elongation and tensile strength that permits fine patterning. Another object is to obtain a copper electrolytic solution that allows uniform copper plating without pinholes on a 2-layer flexible substrate. This copper electrolytic solution comprises as an additive a compound having the specific skeleton represented by General Formula (1) below which is obtained by an addition reaction in which water is added to a compound having in a molecule one or more epoxy groups:
wherein A is an epoxy compound residue and n is an integer of 1 or more.</p> |
申请公布号 |
EP1842939(A1) |
申请公布日期 |
2007.10.10 |
申请号 |
EP20050814382 |
申请日期 |
2005.12.09 |
申请人 |
NIPPON MINING & METALS CO., LTD. |
发明人 |
TSUCHIDA, KATSUYUKI;KOBAYASHI, HIRONORI;KUMAGAI, MASASHI |
分类号 |
C25D3/38;C25D1/04;H05K1/09;H05K3/38;H05K3/42;H05K3/46 |
主分类号 |
C25D3/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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