| 摘要 |
PROBLEM TO BE SOLVED: To provide a device and a method for treatment which are improved in throughput. SOLUTION: A resist removing device 1 is provided with a wafer guide 20 which holds a wafer W, a chamber 10 which houses the wafer W, and an ozone gas supply nozzle 30 which supplies an ozone gas to the chamber 10. The device 1 is also provided with a steam supply nozzle 40 which supplies steam to the chamber 10, an exhaust pipe 17b through which the gas in the chamber 10 is discharged to the outside from the upper part of the chamber 10, and a pure water supply nozzle 60 which supplies a prescribed amount of pure water to the chamber 10. The gas in the chamber 10 is discharged surely to the outside through the exhaust pipe 17b in a short period of time by filling up the chamber 10 with the pure water. COPYRIGHT: (C)2004,JPO |
