发明名称 |
Method and arrangement for forming a microelectronic package |
摘要 |
A method of forming a microelectronic package, and an arrangement to attach a solder preform onto a microelectronic die in order to form the package. The method comprises: providing a reinforced solder preform including a solder preform and a backing layer attached to a backside of the solder preform; placing the reinforced solder preform on a surface of a first microelectronic component adapted to be soldered; attaching the solder preform to the surface of the first microelectronic component after placing the reinforced solder preform; removing the backing layer from the solder preform after placing the reinforced solder preform; placing a second microelectronic component to be soldered onto the solder preform after removing the backing layer; and soldering the second microelectronic component to the first microelectronic component to form the package.
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申请公布号 |
US2007228112(A1) |
申请公布日期 |
2007.10.04 |
申请号 |
US20060394928 |
申请日期 |
2006.03.31 |
申请人 |
SHI WEI;FITZGERALD THOMAS J;MAYER STEVE M;DEPPISCH CARL L;LU DAOQIANG |
发明人 |
SHI WEI;FITZGERALD THOMAS J.;MAYER STEVE M.;DEPPISCH CARL L.;LU DAOQIANG |
分类号 |
B23K31/02 |
主分类号 |
B23K31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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