| 摘要 |
This publication discloses a circuit-board construction and a method for manufacturing an electronic module, in which method at least one component ( 6 ) is embedded inside an insulating-material layer ( 1 ) and contacts ( 14 ) are made to connect the component ( 6 ) electrically to the conductor structures ( 14, 19 ) contained in the electronic module. According to the invention, at least one thermal via ( 22 ), which boosts the conducting of heat away from the component ( 6 ) is manufactured in the insulating-material layer ( 1 ) in the vicinity of the component ( 6 ).
|
