发明名称 |
ARTICLES AND METHODS INCLUDING PATTERNED SUBSTRATES FORMED FROM DENSIFIED, ADHERED METAL POWDERS |
摘要 |
<p>In general the disclosure relates to manufacturing methods for producing conductive patterns on flexible substrates. For example, a layer of a metal powder composition is deposited onto an adhesive overlaying a substrate. Pressure is applied to the metal powder composition on the adhesive coated substrate web by a die having one or more projections, in order to reproduce a pattern on the substrate. The metal powder is compressed by the projections of the die, thereby densifying the powder and causing it to adhere to the adhesive in a reproduction of the die pattern. The metal powder does not adhere substantially in uncompressed regions, and may be removed. In this manner, a metal powder composition may be densified and adhered to a substrate forming a web of flexible circuit elements, for example, circuit elements such as antennas, resistors, capacitors, inductive coils, conduction pads and the like.</p> |
申请公布号 |
WO2007109594(A2) |
申请公布日期 |
2007.09.27 |
申请号 |
WO2007US64253 |
申请日期 |
2007.03.19 |
申请人 |
3M INNOVATIVE PROPERTIES COMPANY |
发明人 |
NEES, TERRY, S.;DO, THANH-HUONG, T.;HACKETT, STEVEN, C.;MICHEL, MATTHEW, J.;BROWN, KATHERINE, A. |
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