发明名称 HIGH TEMPERATURE CURABLE POLYORGANOSILOXANE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a composition excellent in gap-filling performance and giving a cured material without having void even by not loading high pressure. SOLUTION: This curable component contains (A) a mixture obtained by subjecting the following (i) and (ii) to condensation reaction by (30/70) to (70/30) mass ratio for the (i) to (ii) and (B) at least 1 kind of organic peroxide selected from a diacylperoxide and dialkylperoxide, and curing at 130 to 250°C temperature. Provided that (i) an organopolysiloxane having a hydroxy group at the terminal of a molecular chain and having at least one alkenyl group in its molecule and (ii) an organopolysiloxane resin containing the (R<SP>2</SP><SB>3</SB>SiO<SB>1/2</SB>) unit and (SiO<SB>2</SB>) unit by 0.5 to 1.5 molar ratio of the (R<SP>2</SP><SB>3</SB>SiO<SB>1/2</SB>) unit to the (SiO<SB>2</SB>) unit [wherein, R<SP>2</SP>is a 1-10C substituted or non-substituted monovalent hydrocarbon group]. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007231195(A) 申请公布日期 2007.09.13
申请号 JP20060056399 申请日期 2006.03.02
申请人 SHIN ETSU CHEM CO LTD 发明人 KOUCHI SATOSHI
分类号 C08L83/10;C08G77/44;C08K5/14;C09J7/02;C09J11/06;C09J183/04;C09J183/07;H01L21/52 主分类号 C08L83/10
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