| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laser beam machining system capable of applying laser beam machining to a plurality of transparent plates in a laminated state of a workpiece. <P>SOLUTION: A partition device 18 consisting of a beam splitter 19 etc., is disposed between a laser beam generator 16 which generates a laser beam L, and the workpiece 14 arranged in a laminated state with a plurality of the transparent plates 14a, 14a. The laser beam L generated from the laser beam L is guided and irradiated in a way as to focus on the respective transparent plates 14a, 14a so that parts to be processed are formed on the respective transparent plates 14a, 14b. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
