发明名称
摘要 <p>PROBLEM TO BE SOLVED: To provide a connector structure used for connecting a substrate to an electronic component, simple in structure, high in connection reliability owing to surely working contacts, and satisfactory in electrical characteristics. SOLUTION: This connector is made up of an insulator 1 and a multiplicity of contacts 2 rockably held by the insulator 1, and connects an IC package 4 to a substrate 3. Each contact is made up of a held part (a pair of recessed parts 2C) held by the insulator, a substantially rectilinear portion 2A having a first contact part 2D making contact with an inner surface of a through hole 3A in the substrate and a second contact part 2E making contact with a pad 3B formed near the opening part of the through hole, and a curved portion 2B having a third contact part 2F making contact with the IC package. The contacts are inclined relative to the direction connecting the IC package to the substrate.</p>
申请公布号 JP3976217(B2) 申请公布日期 2007.09.12
申请号 JP19990236023 申请日期 1999.08.23
申请人 发明人
分类号 H01R13/24;H01R33/74;H01R107/00 主分类号 H01R13/24
代理机构 代理人
主权项
地址