| 摘要 |
PROBLEM TO BE SOLVED: To enable to suppress peeling of a heat radiating member and to sufficiently form a low melting point metal film such as solder on the surface of the heat radiating member. SOLUTION: An electronic component has a resistive element having surface terminal electrodes 3A to be paired provided on end side regions of an insulating substrate 2, and a resistor 4 arranged on one surface of the insulating substrate 2 and connected to both the surface terminal electrodes 3A; and a heat radiating member 9 arranged on the other surface of the insulating substrate 2 so as not to contact the terminal electrodes 3 and used for heat radiation of the resistive element. The heat radiating member 9 has end face reaching portions 9A1, 9A2 (end face contacting portions) extending up to a second end face 2B which is different from two first end faces 2A of the insulating substrate 2 opposite to an arrangement direction of the terminal electrodes 3 and is arranged to connect the two first end faces 2A; and an end face non-reaching portion 9B (end face non-contacting portion) having a distance between itself and the second end face 2B without extending. COPYRIGHT: (C)2007,JPO&INPIT
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