| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring structure of a semiconductor component which eliminates a defective product of a circuit board, and strengthens an electric path. <P>SOLUTION: In the wiring structure of the semiconductor component, a non-use terminal 3c is insulated from a third land 9a through an insulating film 11. Accordingly, a connection member (soldered) 14 of the non-use terminal 3c is unwanted, a separation of the third land 9a upon exchange of a semiconductor component 1 is eliminated, and a defective product of a circuit board 5 can be eliminated. Further, the third land 9a for the non-use terminal 3c is connected to other lands 7a, 8a or patterns for signals or grounding 7, 8 by a connection pattern 10. Consequently, the third land 9a becomes a part of a pattern. Therefore, a width of its line path can be widened and it can be intended to strengthen the electric path in a high frequency circuit. <P>COPYRIGHT: (C)2007,JPO&INPIT |
