METHOD OF FORMING CURVED SURFACE

摘要

PROBLEM TO BE SOLVED: To provide a method of forming curved surface capable of easily forming a curved surface which is optionally shaped and is smooth. SOLUTION: The method of forming the curved surface 2 of a semiconductor lens 1 (Fig. 1(e)) by removing a part of a semiconductor substrate 10 (Fig. 1(a)) made of p-type silicon substrate comprises: an anode formation process of forming an anode 12 (Fig. 1(c)), on which a contact pattern with the semiconductor substrate 10 is designed in accordance with a desired curved surface (shape of the curved surface 2), so as to make an ohmic contact on one surface side of the semiconductor substrate 10; an anodization process of forming a porous part 14 (Fig. 1(d)) made of porous silicon as a part to be removed on the other surface side of the semiconductor substrate 10 by applying an electric current between a cathode oppositely arranged on the other surface side of the semiconductor substrate 10 in an electrolyte solution of dissolving an oxide of a constitutional element of the semiconductor substrate 10 and the anode 12; and a porous part removal process of removing the porous part 14. COPYRIGHT: (C)2007,JPO&INPIT